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The workshop demonstrates how to perform thermal aware solder fatigue analysis using Ansys Sherlock™ electronics reliability prediction software and Ansys Icepak® electronics cooling simulation software in a co-simulation workflow. You will learn to simulate thermal cycling, export temperature maps from Ansys Icepak software, and assess solder joint reliability using Sherlock’s fatigue prediction tools.
Learning Outcomes:
Following completion of this workshop, you will be able to:
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- Set up solder fatigue analysis in Ansys Sherlock software.
- Configure thermal simulations in Ansys Icepak software.
- Export and import temperature map files (.tmap) between Ansys Icepak and Ansys Sherlock software.
- Perform fatigue analysis using realistic thermal profiles.
- Interpret results: time to failure, cycle to failure, and life prediction.
- Compare reliability outcomes with and without detailed temperature mapping.
Certification Content
Workshop: Solder Fatigue Analysis using Ansys Sherlock and Ansys Icepak Co-Simulation
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Post Completion Survey
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