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The workshop guides users through calculating Theta-JB (junction-to-board) and Theta-JC (junction-to-case) thermal resistances using the Ansys Icepak® electronics cooling simulation software toolkit. You will build a simplified package model, apply power sources, and use the toolkit to extract thermal metrics critical for thermal characterization of electronic components.
Learning Outcomes:
Following completion of this workshop, you will be able to:
- Understand the definitions and significance of Theta-JB and Theta-JC.
- Build a simplified package model in Ansys Icepak software.
- Assign materials and thermal sources to model components.
- Use the Ansys Icepak software toolkit to calculate Theta-JB and Theta-JC.
- Interpret toolkit outputs and thermal resistance values.
- Recognize modeling constraints and toolkit limitations.
Certification Content
Workshop: Calculating Theta-JB and Theta-JC Using Ansys Toolkit
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Post Completion Survey
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