Mechanical Shock of a Printed Circuit Board Assembly in an Enclosure

This course reviews how to perform a Mechanical Shock analysis of a PCBA inside an enclosure using the Ansys Sherlock™ electronics reliability prediction software -Ansys Workbench™ simulation platform integration. This includes project setup, exporting to Ansys Workbench platform / Ansys Mechanical software, alignment of the PCBA to the enclosure, running an analysis, and reviewing results. The primary failure modes of interest are solder & lead failure due to board bending, component motion, and lead bending under mechanical shock loads. In this case, the impact of the larger system (i.e. enclosure) on the PCBA is now captured.

Learning Outcomes:

Following completion of this course, you will be able to:

• Perform a mechanical shock analysis on a PCB with Ansys Sherlock software, including setting up shock pulse profiles and viewing results.
• Align the PCBA with the enclosure using local coordinate systems.
• Reviewing methods to reduce the result file size for reimport into Ansys Sherlock software.

Prerequisites:

• Completion of the Ansys Sherlock Getting Started course or prior knowledge of Ansys Sherlock software.
• Completion of the Mechanical Shock Analysis with Ansys Sherlock Software course.
• Some working knowledge of mechanical shock loads such as shock pulse profiles is a plus.