Mechanical Shock of Multiple Printed Circuit Board Assemblies in an Enclosure

Overview

This course reviews how to perform a mechanical shock analysis of multiple PCBAs inside an enclosure using the Ansys Sherlock™ electronics reliability prediction software - Ansys Workbench™ simulation integration platform. This includes project setup, exporting to Ansys Workbench platform / Ansys Mechanical™ structural finite element analysis software, alignment of the PCBAs to the enclosure, running an analysis, and reviewing results. The primary failure modes of interest are solder & lead failure due to board bending, component motion, and lead bending under mechanical shock loads. In this case, the impact of the larger system (i.e. enclosure) on the PCBA is now captured.

Prerequisites

• Completion of the Ansys Sherlock Getting Started course or prior knowledge of Ansys Sherlock software.
• Completion of the Mechanical Shock Analysis with Ansys Sherlock Software course
• Completion of the Mechanical Shock of a Printed Circuit Board Assembly in an Enclosure.
• Some working knowledge of mechanical shock loads such as shock pulse profiles is a plus.

Learning Outcomes:

Following Completion of this course you will be able to:

• Perform a mechanical shock analysis on a PCB with Ansys Sherlock software, including setting up shock pulse profiles and viewing results.
• Align the PCBA with the enclosure using local coordinate systems.
• Review methods to reduce the result file size for reimport into Ansys Sherlock software.

Please note: These training materials were developed and tested in the 2024R2 release.