Electronics Thermal Management using Ansys Icepak Software in Ansys Electronics Desktop (AEDT) Platform: Advanced

Ansys Icepak® electronics cooling simulation software provides flow and thermal management solutions for many types of electronic design applications. The primary goal of this course is to build upon the content discussed in the 'Electronics Thermal Management using Ansys Icepak Software in Ansys Electronics Desktop (AEDT) Platform: Getting Started' course and cover advanced features of Ansys Icepak software in the Ansys Electronics Desktop (AEDT)™ electronics systems design platform. You will be introduced to the world of electronics thermal modeling through a combination of lectures, workshops, and examples/demonstrations.

Learning Outcomes: 

Following Completion of this course you will be able to:

• Import MCAD geometry into Ansys Icepak software in AEDT platform and use defeaturing tools.
• Model an inclined PCB. Perform electrothermal analysis using Ansys HFSS 3D Layout software - Ansys Icepak software workflow.
• Use advanced meshing techniques.
• Perform a transient simulation.
• Setup and perform Optimetrics analysis.
• Learn about special applications like MRF modeling, turbulence models, toolkits, and ACTs.

Prerequisites:

• A technical education and background in electronics and/or fluid mechanics and heat transfer is recommended.
• Completion of the 'Electronics Thermal Management using Ansys Icepak Software in Ansys Electronics Desktop (AEDT) Platform: Getting Started' course is recommended.

Please note:These training materials were developed and tested in the 2025R1 release.