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  3. Case studies on thermal-stress simulation for multi-die 2.5D packaging

Case studies on thermal-stress simulation for multi-die 2.5D packaging

    • April 25, 2026 at 9:15 am
      pangzw3
      Subscriber

      Our project is currently exploring the impact of packaging simulation on multi-die (including sensors and ASIC chips). We would like to see how various parameters of the chips and sensors change after thermal-stress simulation. Are there any relevant case studies on 2.5D multi-die packaging simulation available?

    • April 28, 2026 at 12:46 am
      Praneeth
      Ansys Employee

      Hi,

      Thank you for reaching out to the Ansys learning forum. Your patience is much appreciated.

      Please let us know the tool name of Ansys that you are using to help us serve you better. You can also add tags of the tool in your future post.

      Best regards,
      Praneeth.

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