Learning Forum

[pangzw3]

Our project is currently exploring the impact of packaging simulation on multi-die (including sensors and ASIC chips). We would like to see how various parameters of the chips and sensors change after thermal-stress simulation. Are there any relevant case studies on 2.5D multi-die packaging simulation available?

[Praneeth]

Hi,

Thank you for reaching out to the Ansys learning forum. Your patience is much appreciated.

Please let us know the tool name of Ansys that you are using to help us serve you better. You can also add tags of the tool in your future post.

Best regards,
Praneeth.

[pangzw3]

Hi,

Dear Praneeth,

Thank you for your response.

We are currently considering using the Ansys AEDT platform (Electronic Desktop) for our thermal-stress simulation, and we are particularly interested in the Icepak and Mechanical tools within AEDT for multi-die 2.5D packaging analysis.

Could you kindly share if there are any case studies, application notes, or workflow examples that demonstrate the thermal-stress simulation of 2.5D packaging involving sensors and ASIC chiplets? We would greatly appreciate any guidance on how to observe the parameter changes in the chips and sensors under thermal and mechanical stress.

Thank you very much for your support.

Best regards,
Ziwei Pang.