Mechanical Shock Analysis with Ansys Sherlock Software

This course reviews how to perform a Mechanical Shock analysis inside of Ansys Sherlock™ electronics reliability prediction software. This includes setting up a project in Ansys Sherlock software, defining the loads and life cycle, defining the mount points, running the analysis, and reviewing the results. The performance of a solder joint when subjected to mechanical shock is primarily dictated by the ductility of the solder and the fragility of the interconnect structure. The strengths of these regions and the amount of stress transmitted to them during the shock event will determine whether failure occurs. The primary failure modes of interest are solder & lead failure due to board bending, component motion, and lead bending under mechanical shock loads.

Learning Outcomes:

Following completion of this course, you will be able to:

• Perform a mechanical shock analysis on a PCB with Ansys Sherlock software, including setup and viewing results.
• Learn how to input various shock pulse profiles.

Prerequisites:

• Completion of the Ansys Sherlock Getting Started course or prior knowledge of Ansys Sherlock software.
• Some working knowledge of mechanical shock loads such as shock pulse profiles is a plus.

Please note: These training materials were developed and tested in the 2024R2 release.