Solder Fatigue Analysis using Ansys Sherlock and Ansys Icepak Co-Simulation

The workshop demonstrates how to perform thermal aware solder fatigue analysis using Ansys Sherlock™ electronics reliability prediction software and Ansys Icepak® electronics cooling simulation software in a co-simulation workflow. You will learn to simulate thermal cycling, export temperature maps from Ansys Icepak software, and assess solder joint reliability using Sherlock’s fatigue prediction tools.

Learning Outcomes:

Following completion of this workshop, you will be able to:

• • Set up solder fatigue analysis in Ansys Sherlock software.
  • Configure thermal simulations in Ansys Icepak software.
  • Export and import temperature map files (.tmap) between Ansys Icepak and Ansys Sherlock software.
  • Perform fatigue analysis using realistic thermal profiles.
  • Interpret results: time to failure, cycle to failure, and life prediction.
  • Compare reliability outcomes with and without detailed temperature mapping.