This workflow allows you to have access to local metal fraction and thus local thermal conductivity, within a printed circuit board (PCB) in Ansys Fluent® fluid simulation software.
The thermal conductivity of a PCB varies considerably due to the layered construction and highly variable metal fraction at any location. Therefore, thermal analysis of a PCB requires knowledge of the orthotropic components of thermal conductivity (that is, X, Y, and Z components of thermal conductivity).
Ansys Fluent software provides the PCB model, to automate the workflow, enabling the necessary case settings to prepare for thermal analysis of the PCB zones. This includes, computing the orthotropic components of thermal conductivity as mentioned, and the power map distribution of a PCB.
Learning Outcomes:
Following completion of this course, you will be able to:
- Set up a PCB from ECAD data file to obtain local thermal conductivity necessary for thermal management of an electronic device.
Prerequisites:
- Ansys Fluent Getting Started: Basics
- Ansys Fluent Beyond Basics training
- Ansys Fluent Multiphase Flow Modeling
Please note: These training materials were developed and tested in the 2023R1 release.
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Cost: $450.00
- Course Duration: 2-4 HOURS
- Skill Level: Intermediate
- Skills Gained: Set up a PCB from ECAD, Thermal Management, Electronic device
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