Overview
In the evolving landscape of electronics cooling, achieving optimal thermal performance is essential for reliability, efficiency, and cost-effectiveness. Ansys optiSLang, when coupled with AEDT Icepak, offers a robust, automated, and intelligent optimization workflow to enhance the thermal designs of electronic components and systems.
optiSLang facilitates parametric, sensitivity, and robust design optimization by leveraging advanced techniques, including response surface modeling, design of experiments (DOE), and global and local optimization algorithms. Instead of relying on costly and time-consuming solver evaluations during every iteration, pre-optimization is performed using the metamodel rather than the solver, which significantly accelerates the design exploration process. Generated metamodels can be used in subsequent optimization as a substitute for the physical solver.
Key advantages of using optiSLang with AEDT Icepak include:
- Efficient evaluation of multiple design variations
- Identify the best cooling solutions based on key objectives such as temperature reduction or material cost savings
- Understand how design parameters impact thermal performance and improve design robustness
- Seamless integration of thermal and electromagnetic domains within a unified optimization environment
In summary, this webinar will demonstrate how optiSLang and AEDT Icepak can transform traditional thermal design workflows, using real-world examples to demonstrate their capabilities.
What You Will Learn
- Seamless Icepak and optiSLang integration
- Model-based pre-optimization
- Sensitivity and optimization analysis
- Integration with multiphysics simulations
Who should attend
- Design Engineers, Thermal Simulation Engineers, CFD Engineers
Speaker
- Sreeharsh Nair
Date / Time:August 12, 2025 11 AM IST
Venue:Virtual
- Cost:
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