CFD Simulation for Immersion Cooling: Boiling Model​ (ABP)

This Application Best Practice (ABP) presents one methodology to deal with immersion cooling involving boiling to cool down a hot component using Ansys Fluent® fluid simulation software. The idea is to represent the boiling curve by just changing the bubble departure diameter as a unique modified parameter. This approach can be combined with PCB workflow model in Ansys Fluent software for considering real PCB characteristic for electronic cooling.

Learning Outcomes:

Following completion of this Application Best Practice (ABP), you will be able to:

• Set up an Ansys Fluent software case with RPI-Non equilibrium boiling model
• Automatically modified the bubble departure diameter
• Combine boiling model with PCB workflow for electronic component cooling

Prerequisites:

• Ansys Fluent Multiphase Flow Modeling

Please note: These training materials were developed and tested in the 2024R2 release.

Application Best Practices (ABPs) outline engineering design goals for specific applications and provide guidance for how to achieve those goals using Ansys simulation software. It is important to note that a Geometry File or other Input Files are not always available. ABPs, as opposed to the official training-material workshops/tutorials, are not meant to be a step-by-step instruction document. ABPs are a link between product-based training courses and application specific tutorials, educating on the "how" and "why" of the best modeling approach, highlighting best practices and workflows for a particular application.