Calculating Theta-JB and Theta-JC Using Ansys Toolkit

The workshop guides users through calculating Theta-JB (junction-to-board) and Theta-JC (junction-to-case) thermal resistances using the Ansys Icepak® electronics cooling simulation software toolkit. You will build a simplified package model, apply power sources, and use the toolkit to extract thermal metrics critical for thermal characterization of electronic components.

Learning Outcomes:

Following completion of this workshop, you will be able to:

• • Understand the definitions and significance of Theta-JB and Theta-JC.
  • Build a simplified package model in Ansys Icepak software.
  • Assign materials and thermal sources to model components.
  • Use the Ansys Icepak software toolkit to calculate Theta-JB and Theta-JC.
  • Interpret toolkit outputs and thermal resistance values.
  • Recognize modeling constraints and toolkit limitations.