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Ansys Optics Deep Dive: Fiber-to-Chip Coupling Solutions for Co-Packaged Optics

Ansys

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Overview

Co-packaged optics (CPO) are increasingly being viewed as 1 necessary technology to provide high bandwidth at low power in today’s hyper modern data centers. Fiber to chip coupling is fundamental to realizing the benefits of CPO because it's the gateway through which light leaves (or enters) the photonic chip and enters (or leaves) the fiber network. In this comprehensive virtual event, we will delve into cutting-edge advancements in Ansys Optics software solutions that enable the robust and efficient design of fiber-to-chip coupling systems for CPO. This will include a review of our latest product enhancements in support of fiber-to-chip coupling, followed by a live demonstration showcasing the development of systems for both vertical and edge coupling configurations. A customer presentation will provide real-world insights, and a live Q&A session will ensure that your questions are answered. This event is your gateway to unlocking new levels of performance, reliability, and innovation in your fiber-to-chip coupling designs.

  • Enhance your skills to achieve better fiber-to-chip coupling system designs.
  • Learn about streamlined workflows that apply advanced features and best practices.
  • Connect with industry peers and exchange valuable insights.
  • Stay up to date on Ansys Optics software updates.

Date / Time:August 21, 2025
7:30 PM - 10:00 PM IST
Venue:Virtual

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