This course is part of Ansys HFSS EMI EMC CISPR25 learning plan using Ansys Electronics Desktop (AEDT)™ electronics systems design platform. In this course, the conducted emission (CE) simulation of a PCB is performed using Ansys HFSS 3D Layout software, Ansys HFSS™ high-frequency electromagnetic simulation software and AEDT Circuit using a remote ground as per CISPR25 standard.
Learning Outcomes:
Following completion of this course, you will be able to:
- Import a PCB from an ANF format file and set up solder ball properties and ports in Ansys HFSS 3D Layout.
- Export an Ansys HFSS 3D Layout design to Ansys HFSS software.
- Set up Ansys HFSS EM blocks in circuit schematics and drive with transient signals.
- Import CISPR 2008 standard templates to overlay on plots.
Prerequisites:
- Ansys HFSS Getting Started.
- Working knowledge of Ansys HFSS 3D Layout software.
- Set up and edit the schematic symbols for the HFSS EM block in AEDT Circuit.
- Schematic component placement, connection and transient signal source setup in AEDT Circuit.
- Ansys HFSS EMI EMC CISPR25 - CE Local Ground.
- Familiarity with emissions testing and the CISPR25 2008 specification.
Please note: These training materials were developed and tested in 2021 R2 release. However, due to kernel change, simulation files compatible from 2025R1 version are also provided.
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Cost: $450.00
- Course Duration: 2-4 HOURS
- Skill Level: Expert
- Skills Gained: Import a PCB and set up solder ball properties and ports in Ansys HFSS 3D Layout, Export an Ansys HFSS 3D Layout design to Ansys HFSS software, Set up Ansys HFSS EM blocks in AEDT Circuit schematics and drive with transient signals
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