This course demonstrates the workflow for analyzing layered structures using Ansys HFSS 3D Layout. This course includes integrating 3D Components and PCBs in Ansys HFSS 3D Layout design, Via optimization, modeling and analysis of passive and active circuits in Ansys HFSS 3D Layout, and ECAD Xplorer workflow to preprocess large GDSII format files before translating them to Ansys HFSS 3D Layout. This course is designed for the workshops to be used and these workshops instruct different applications following realistic workflows from start to end.
Learning Outcomes:
Following completion of this workshop, you will be able to:
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- Import and integrate 3D components and PCB designs in Ansys HFSS 3D Layout.
- Define ports on 3D component after integration with PCB and mesh all together and run analysis.
- Create sub-design cutouts to run parametric study on a section of a board and parameterize and optimize vias to achieve desirable differential S-parameters in the operational bandwidth.
- Configure a passive circuit such as filter, assign boundary conditions and excitations, analyze the design and plot fields on different layers.
- Characterize low noise amplifier and run Harmonic Balance analysis in Ansys HFSS 3D Layout.
- Create dynamic link between Ansys HFSS 3D Layout and circuit designer and how to observe the behavior of the EM field using Push Excitations.
- Import GDSII and XML files and apply ECAD Xplorer to simplify GDSII files before translating them into Ansys HFSS 3D Layout.
Prerequisites:
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- Prior knowledge of Ansys HFSS 3D Layout Getting Started course is required.
- Knowledge of printed circuit board design including vias, component reference designators, and layer stackups is valuable.
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Cost: $450.00
- Course Duration: 6+ HOURS
- Skill Level: Expert
- Skills Gained: PCB Design Integration, Signal Integrity & S-Parameter Optimization, RF Circuit Simulation & Harmonic Balance Analysis, EM-Circuit Co-Simulation and GDSII Layout Translation
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