Overview
Discover how the latest innovations in Ansys Sherlock are helping engineers accelerate reliability-driven design with greater confidence. Explore the new Sherlock App in Ansys Mechanical for unified workflows, along with advanced capabilities for thermal rainflow cycle counting and Thermal-Mechanical BGA package life prediction. Learn how these updates streamline workflows and provide deeper insight into system reliability.
What Attendees Will Learn
- Electronics reliability workflow enhancements in Ansys Sherlock
- Seamless Sherlock integration in Ansys Mechanical
- Thermal Rainflow Cycle Counting for fatigue analysis
- Thermal‑Mechanical BGA life prediction (full release)
- Enhanced reliability scoring and reporting
Who Should Attend
This webinar is ideal for electronics reliability engineers, PCB and packaging analysts, thermal‑mechanical simulation specialists, and CAE teams using Ansys Sherlock to improve durability predictions and design confidence.
Speaker
- Kelly Morgan - Applications Engineering, Sr Architect, Ansys
Date / Time:
October 8, 2026
11 AM EDT
Venue: Virtual
- Cost:
No reviews available for this learning resource.
