Ansys Assistant will be unavailable on the Learning Forum starting January 30. An upgraded version is coming soon. We apologize for any inconvenience and appreciate your patience. Stay tuned for updates.
Electronics

Electronics

  1. All Categories
  2. I am modeling an interface material, shall I use contact resistance/thin plate or a general heat transfer (full thickness) plate? - Electronics
  3. I am modeling an interface material, shall I use contact resistance/thin plate or a general heat transfer (full thickness) plate?

I am modeling an interface material, shall I use contact resistance/thin plate or a general heat transfer (full thickness) plate?

Tagged: 1/14/1900, Basic Object Types, Electromagnetics & Electronics, icepak, Solid objects
    • September 22, 2023 at 11:02 am
      SolutionSolution
      Participant

      Please refer to the attachments to access the Solution.

      Attachments:
      1. 2009775.pdf

Featured Articles

Introducing Ansys Electronics Desktop on Ansys Cloud

The Watch & Learn video article provides an overview of cloud computing from Electronics Desktop and details the product licenses and subscriptions to ANSYS Cloud Service that are...

How to Create a Reflector for a Center High-Mounted Stop Lamp (CHMSL)

This video article demonstrates how to create a reflector for a center high-mounted stop lamp. Optical Part design in Ansys SPEOS enables the design and validation of multiple...

Introducing the GEKO Turbulence Model in Ansys Fluent

The GEKO (GEneralized K-Omega) turbulence model offers a flexible, robust, general-purpose approach to RANS turbulence modeling. Introducing 2 videos: Part 1 provides background information on the model and a...

Postprocessing on Ansys EnSight

This video demonstrates exporting data from Fluent in EnSight Case Gold format, and it reviews the basic postprocessing capabilities of EnSight.

© 2026 Copyright ANSYS, Inc. All rights reserved.