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Heat Transfer

Heat Transfer

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  3. How to simulate the Thermal Resistance due to a Gap between the Clotting Substance

How to simulate the Thermal Resistance due to a Gap between the Clotting Substance

Tagged: 17.2, BCs & Interfaces, fluent, fluid-dynamics, Heat Transfer and Radiation, heat-transfer, materials
    • March 17, 2023 at 1:11 pm
      SolutionSolution
      Participant

      Please refer to the attachment to access the Solution.

      Attachments:
      1. 2043833.pdf

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