-
-
May 5, 2024 at 7:13 amSolutionParticipant
In this article we will explore design scenarios using Ansys Discovery to lower the temperature of the CPUs, and thus ensure thermal safety by altering the material, altering the geometry, and altering the heat sink operating environment.
Refer the attached document and Simulation files on how to set up test cases, update design to analyze the impact of the material, geometry and heat sink operating environment on heat sink performance. We will explore these design scenarios and observe the improvements.
-
Introducing Ansys Electronics Desktop on Ansys Cloud
The Watch & Learn video article provides an overview of cloud computing from Electronics Desktop and details the product licenses and subscriptions to ANSYS Cloud Service that are...
How to Create a Reflector for a Center High-Mounted Stop Lamp (CHMSL)
This video article demonstrates how to create a reflector for a center high-mounted stop lamp. Optical Part design in Ansys SPEOS enables the design and validation of multiple...
Introducing the GEKO Turbulence Model in Ansys Fluent
The GEKO (GEneralized K-Omega) turbulence model offers a flexible, robust, general-purpose approach to RANS turbulence modeling. Introducing 2 videos: Part 1Â provides background information on the model and a...
Postprocessing on Ansys EnSight
This video demonstrates exporting data from Fluent in EnSight Case Gold format, and it reviews the basic postprocessing capabilities of EnSight.
- Discovery: Porous media coefficient calculator
- Ansys Discovery: Topology Optimization
- Ansys Discovery- Intake and Exhaust Fan for Fluids
- Discovery Analyze Mode – Unable to view or change material properties.
- Discovery Explore: How to retain a certain portion of the geometry in topology optimization?
- Ansys Discovery: Activating Beta Feature
- Discovery Refine mode – Viewing mesh
- Ansys Discovery: Contact Review Tool
- Discovery Quick Tip – Changing Turbulence model
- In-Depth – Fluids Simulation using Ansys Discovery
© 2024 Copyright ANSYS, Inc. All rights reserved.