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In this part we compare the stackups of the printed circuit board between Mentor Xpedition and ANSYS SIwave. The video clearly explains how the different material properties, the thicknesses, and other properties are translated to SIwave. Another important feature shown in the video is the process of generating data files with component values from SIwave. The values are modified and the data file is imported back to SIwave and the component values are changed accordingly to reflect the ones in the bill of materials file. Another key feature shown in the video is using an XML control file that can control the ODB properties to be read in by SIwave and their order. For instance, the file is configured to read in a property field in the ODB++ database that can straightaway translate all component values accurately while importing the ODB++ directory to SIwave.