TAGGED: mesh-generation
-
-
September 28, 2020 at 7:35 pm
DoodlerD
SubscriberHi,
What would be the ideal way to mesh a bonded joint between two structural components using mid surfaces? (ANSYS WB 2014)
1. A gap with MPC elements and pinball radius (as shown) or
2. No gap and connected structural components
I believe the latter will increase mass and rigidity because of the mid surface mesh.
Thank you!
September 29, 2020 at 3:37 pmAshish Khemka
Forum ModeratornnUse MPC contact for bonded as much as possible unless overconstraints exist. It is-n? Ideal for shell-solid, shell-shell, and beam-shell contactsn? Interface with small gap/penetrationn? It avoids spurious frequencies for modal analysisn? Rather than modify the geometry to fill the gap, they cannbe accurately ignored when using MPC Contact or a fixednjoint.nRegards,nAshish KhemkanOctober 1, 2020 at 3:05 pmDoodlerD
SubscriberThank you for your advice, my sumulation was successful nViewing 2 reply threads- The topic ‘Surface to Surface Contact, Mid-Surface Mesh’ is closed to new replies.
Innovation SpaceTrending discussionsTop Contributors-
4803
-
1582
-
1386
-
1242
-
1021
Top Rated Tags© 2026 Copyright ANSYS, Inc. All rights reserved.
Ansys does not support the usage of unauthorized Ansys software. Please visit www.ansys.com to obtain an official distribution.
-
The Ansys Learning Forum is a public forum. You are prohibited from providing (i) information that is confidential to You, your employer, or any third party, (ii) Personal Data or individually identifiable health information, (iii) any information that is U.S. Government Classified, Controlled Unclassified Information, International Traffic in Arms Regulators (ITAR) or Export Administration Regulators (EAR) controlled or otherwise have been determined by the United States Government or by a foreign government to require protection against unauthorized disclosure for reasons of national security, or (iv) topics or information restricted by the People's Republic of China data protection and privacy laws.
