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[Neil]

[Sampat Kumar]

Hi Neil, 
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Sampat

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[Neil]

Sorry,

I am currently using ANSYS APDL to simulate a model of a four-layer laminated board. However, I have encountered some challenges regarding the temperature heating-up to 230 degrees Celsius in the third step and the temperature cooling-down to 25 degrees Celsius in the fifth step. These temperature values do not align with the experimental data, and I am unsure if there might be an error in my settings.

I have included the coding I used for these steps below for your reference. I would greatly appreciate your assistance in identifying any potential errors or suggesting any necessary adjustments.

TREF ,25    !Global reference temperature
!!!!!!!!Load step1!!!!!!!!!!
/SOLU
stabilize,constant,energy,0.001,yes,0.2 
OUTRES,all,ALL
Nropt,full
nSEL,S,LOC,X,0
D,all, ux,
ALLS
NSEL,s,LOC,y,0
D,all, uy
ALLS
NSEL,S,LOC,X,0
NSEL,r,LOC,z, T3+T4+T5+T12,
NSEL,r,LOC,y,0
D,ALL,all,0
ALLS
ESEL,S,mat,,3
ESEL,A,mat,,4
ESEL,A,mat,,5
ESEL,A,mat,,6
ESEL,A,mat,,7
ESEL,A,mat,,8
ESEL,A,mat,,9
ESEL,A,mat,,10
ESEL,A,mat,,11
ESEL,A,mat,,12
EKILL,all
allsel,all
BF,ALL,TEMP,27.3    
 
SOLVE
!!!!!!!!!Load step2!!!!!!!!!!
/SOLU
ESEL,S,mat,,3
EAlIVE,all
allsel,all 
BF,ALL,TEMP,28.4    
SOLVE
!!!!!!!!!Load step3!!!!!!!!!!
/SOLU
BF,ALL,TEMP,230     
SOLVE
!!!!!!!!!Load step4!!!!!!!!!!
/SOLU           
ESEL,S,mat,,4
EAlIVE,all
allsel,all
BF,ALL,TEMP,230     
SOLVE
!!!!!!!!!Load step5!!!!!!!!!!
/SOLU
BF,ALL,TEMP,25     
SOLVE