Learning Forum

[Atefeh Sadrimofakham]

Hello eveyone. I am working on wafer simulation in CMP process. Do you know how we can see/gain the results for material removal rate (MRR)?

[Praneeth]

Hi,

Thank you for reaching out to the Ansys learning forum. We appreciate your patience.

Unfortunately, we could not reply to you earlier as we did not notice your post until now.

Please let us know the Ansys tool that you are using to help us serve you better.

Best regards,
Praneeth.

[Atefeh Sadrimofakham]

In Chemical Mechanical Polishing process, we polish a Silicon Oxide/Nitride wafer on the Polyurthane pad. The ununiformity on the wafer surface will be decreased  and flattened based on this process. So, I wonder if is there any possibilty to calculate the amount of the Material Removal Rate from the wafer surface? (It is something like erosion.) https://en.wikipedia.org/wiki/Chemical-mechanical_polishing. Here is more information about the CMP process.

[Praneeth]

Hi Atefeh,

Please provide the Ansys tool name that you wish to use to help us serve you better.

Best regards,
Praneeth. 

[Atefeh Sadrimofakham]

Ansys Fluent

[Essence]

Hello,

Did you try using the Ansys Rocky which can be coupled with Ansys Fluent for your application?