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Low Temperature Co-Fired Ceramics (LTCC) with embedded components – Icepak

- March 31, 2026 at 11:29 am
  
  yadu.krishnan
  Subscriber
  
  What is the method to use for simulating Low Temperature Co-Fired Ceramics (LTCC) with embedded components in Icepak. Can we use PCB component and ECAD import ? or only MCAD ?
- April 1, 2026 at 12:09 am
  
  Takeshi Itadani
  Ansys Employee
  
  The following link may be helpful.
  ETM Using Ansys Maxwell and Icepak | Ansys Innovation Courses
  ETM using Ansys HFSS and Icepak | Ansys Innovation Courses

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