Learning Forum

[warrensu]

This was asked in the reply section of another question but it didn't receive an answer so I'm posting a new one.

I like to model a thermal cycling/reflow situation where my PCB will heat -> cooldown -> reheat again. In reality, deformation after three cycles will definitely be different from after just one cycle of heating and cooling. In ANSYS Static Structural, I added the following temperature points to my thermal condition.

[dlooman]

To get a different solution you need to have a property that produces nonrecoverable strain such as plasticity or creep. It might also be possible to model the reflow condition with the "Birth and Death" feature by "killing" the solder material at high temperature.