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Ansys Learning Forum › Forums › Discuss Simulation › General Mechanical › How to realistically model PCB warpage? › Reply To: How to realistically model PCB warpage?

July 29, 2021 at 3:51 pm
dlooman
Ansys Employee
To get a different solution you need to have a property that produces nonrecoverable strain such as plasticity or creep. It might also be possible to model the reflow condition with the "Birth and Death" feature by "killing" the solder material at high temperature.