Learning Forum

[pranav5]

Hello,

I'm studying Si die/chip warpage and forces required to flatten them (Image of the schematic is attached). The dimensions of the die are 10,000 um length, 6000 um width and 300-700 um thickness. The die warpage is 0.1-1 um. 

When I sketch such geometry in DesignModeler and try to extrude it along the width, I get:

Error: No profiles could be swept along the selected direction vector

Context: Extrude Feature Extrude2

How can I fix this? 

Thanks,
Pranav

 

[peteroznewman]

Please insert images directly into your posts with the Insert Image button.

[pranav5]

Thanks, Peter. I've updated the post as per your suggestion.

[Rob]

You've probably run of of significant figures in the CAD tolerance/accuracy.  Try building it so warpage is 1cm, and die length is 10,000 cm.   I assume you can rescale in Mechanical? 

If that doesn't work can you squash the die length (scale) to build the model and then stretch (scale) in Mechanical once it's meshed?