Multiphysics Modeling of HBM for 3D Heterogeneous Integration
What attendees will learn
- Multiphysics challenges of integrating HBM in 3DICs
- Engineering goals for multiphysics analysis of HBMs
- HBM modeling techniques from prototyping to signoff
- ML-driven system co-optimization for HBM
Who should attend
IC/ Chip designers, IC/ Chip methodology engineers, 3DIC architects, System engineer
Speakers
Lang Lin, Principal Product Manager
Speakers
Ajay Agrawal