Multiphysics Modeling of HBM for 3D Heterogeneous Integration

What attendees will learn

  • Multiphysics challenges of integrating HBM in 3DICs
  • Engineering goals for multiphysics analysis of HBMs
  • HBM modeling techniques from prototyping to signoff
  • ML-driven system co-optimization for HBM

Who should attend

IC/ Chip designers, IC/ Chip methodology engineers, 3DIC architects, System engineer

Speakers

Lang Lin, Principal Product Manager

Speakers

Ajay Agrawal

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