This course introduces the use of Linear Parameter-Varying (LPV) Reduced Order Model (ROM) generation for electronics system in natural convection physics using Ansys Electronics Desktop (AEDT)™ electronics systems design platform, Ansys Icepak® electronics cooling simulation software and Ansys Twin Builder® simulation-based digital twin platform.
In high-fidelity thermal simulations, especially for large-scale systems, transient CFD analyses can be prohibitively time-consuming and resource-intensive. To address this challenge, Linear Parameter-Varying (LPV) Reduced Order Model (ROM) can be a powerful technique that significantly reduces simulation time while preserving accuracy.
While LPV ROMs are traditionally applied to forced convection problems, this course explores an innovative approach to extending their application to natural convection. By assuming a constant thermal energy exchange rate from heat sources to interfaces, the method enables the use of surface Heat Transfer Coefficients (HTCs) to represent complex natural convection behavior.
You will gain hands-on experience with the complete workflow for evaluating LPV ROMs in natural convection scenarios, enabling faster and more efficient system-level thermal analysis.
Learning Outcomes:
Following completion of this tutorial, you will be able to:
- Generate Linear Parameter Varying Reduced Order Model (LPV ROM) to natural convection problems using Heat Transfer Coefficient (HTC) - based modeling.
- Implement a practical workflow for evaluating LPV ROM in natural convection physics.
- Assess the accuracy and efficiency of ROM-based simulations compared to full CFD models.
Prerequisites:
- Electronics Thermal Management using Ansys Icepak in Ansys Electronics Desktop (AEDT): Getting Started
- Electronics Thermal Management using Ansys Icepak in Ansys Electronics Desktop (AEDT): Advanced
Please note: These training materials were developed and tested in the 2025R2 release.
