This course introduces the Ansys Chip-Package-System (CPS) thermal workflow, focusing on importing CTM-based power maps into Ansys Icepak® electronics cooling simulation software and exporting thermal data for Synopsys RedHawk-SC Electrothermal™ thermal and multiphysics signoff platform for 3D integrated circuits (3D-IC) back annotation. You will simulate system-level thermal behavior and prepare data for chip-level thermal analysis.
Learning Outcomes:
Following completion of this tutorial, you will be able to:
- Open and navigate Ansys Icepak software project with a detailed IC package.
- Import CTM-based power maps onto a die surface.
- Configure mesh regions for CTM models.
- Run system-level thermal simulations in Ansys Icepak software.
- Export monitor data for Synopsys RedHawk-SC Electrothermal software back annotation.
- Post-process simulation results for thermal visualization.
Please note: These training materials were developed and tested in the 2025R1 release.
