Integrating CTM Power Maps and RedHawk Back Annotation in Ansys Icepak Software (Workshop)

This course introduces the Ansys Chip-Package-System (CPS) thermal workflow, focusing on importing CTM-based power maps  into Ansys Icepak® electronics cooling simulation software and exporting thermal data for Synopsys RedHawk-SC Electrothermal™ thermal and multiphysics signoff platform for 3D integrated circuits (3D-IC) back annotation. You will simulate system-level thermal behavior and prepare data for chip-level thermal analysis.

Learning Outcomes:

Following completion of this tutorial, you will be able to:

• Open and navigate Ansys Icepak software project with a detailed IC package.
• Import CTM-based power maps onto a die surface.
• Configure mesh regions for CTM models.
• Run system-level thermal simulations in Ansys Icepak software.
• Export monitor data for Synopsys RedHawk-SC Electrothermal software back annotation.
• Post-process simulation results for thermal visualization.

Please note: These training materials were developed and tested in the 2025R1 release.