Dynamic Thermal Management in 2.5D ICs -Thermostat Based Power Source Control (Workshop)

This course focuses on the dynamic thermal management of 2.5D ICs using thermostat-based power source control in Ansys Icepak® electronics cooling simulation software. The course is designed to help you understand how to simulate transient thermal behavior in devices that require frequency/power modulation to prevent overheating or maintain optimal performance.

Learning Outcomes:

Following completion of this tutorial, you will be able to:

• Grasp the principles of dynamic thermal management and the capabilities of Ansys Icepak software to simulate these scenarios.
• Effectively set up and utilize the DTM toolkit for transient thermal simulations.
• Analyze and interpret simulation results, including temperature and heat flow rate data, and export data for further processing.

Please note: These training materials were developed and tested in the 2025R1 release.