Overview
The Stacker Meshing workflow in Ansys Mechanical introduces a powerful and efficient approach for handling 2.5D geometries, particularly those found in electronic assemblies such as PCBs, BGAs, and semiconductor packages. By leveraging a layer-based meshing strategy, the workflow captures true thickness and material variation without the overhead of full 3D geometric detail, enabling high-quality meshes with significantly reduced computational cost.
While especially valuable to the electronics industry, Stacker Meshing is equally effective for any layered 2.5D structure across industries, including laminated composites, thin-film assemblies, and other stacked configurations. Its automation, robustness, and solver-friendly mesh generation make it a versatile solution for accelerating thermal, structural, and multiphysics simulations in a wide range of engineering applications.
What Attendees Will Learn
- Attendees will learn the new paradigm for meshing available in Ansys Mechanical under Mesh Workflow.
- Will understand what level of complexity can be handled with less pre-processing efforts.
Who Should Attend
- PCB design & simulation
- Semiconductor package modelling
- BGA / chip-package / IC assembly simulation
- Electronics cooling & reliability engineering
- Engineers from other industries whose geometry contains 2.5D parts, sub-assemblies.
Speaker
- Aditya Kshatriya
Date / Time: May 22, 2026, 11:30 AM EDT
Venue: Virtual
- Cost:
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