Overview
The high-tech industry is currently facing new design constraints and limitations driven by miniaturization, faster time-to-market demands, sustainable material efforts, and the increasing need for effective thermal management of electronics. This is resulting in engineers needing updated, modern workflows so they can innovate intelligent designs quickly.
What Attendees Will Learn
In this webinar, we’ll cover the latest enhancements across our Ansys Fluids portfolio, enabling engineers to perform faster high-tech fluid and thermal workflows with no loss of fidelity.
- Simulate electronics packaging, manufacturing and reliability with GPU-accelerated solvers to perform simulations such as glue dispensing, underfill, aeroacoustics, chemical mechanical polishing, chip encapsulation and more that are orders of magnitude faster than CPU-only configurations.
- Perform early design system-level analyses in seconds to minutes with mixed-fidelity 0D to 3D models for cooling cycles, heat exchanges, thermosyphons, and more.
- Leverage newly available Ansys AI tools and PyAnsys open ecosystems to improve productivity by generating and evaluating numerous alternative design options in minutes and automate and customize time-intensive workflows through Python scripting.
Who Should Attend and Why
- Thermal, Mechanical, CFD, audio/acoustics engineers, CFD specialists, R&D leaders, and high-tech product designers aiming to reduce development time while improving simulation accuracy and reliability
Speakers
- Sreenivas Viyyuri
- Siddhant Desai
Date / Time:October 16, 2025
11 AM EDT
Venue:Virtual
- Cost:
No reviews available for this learning resource.
