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Discovery Physics

Discovery Physics

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  3. Thermal Analysis of Heat Sinks with Ansys Discovery

Thermal Analysis of Heat Sinks with Ansys Discovery

Tagged: Ansys Discovery, conjugate-heat-transfer, cpu, Flow speed, Heat Flow, heat sink, material, monitors, Parametric Study, parametric-analysis, steady-state-thermal, temperature contours, temperature transfer, thermal safety
    • May 5, 2024 at 11:11 am
      SolutionSolution
      Participant

      In this article we will learn how Ansys Discovery can be used to perform thermal analysis of a heat sink placed above two CPUs generating heat during intense computational tasks.

      Please refer the attached document for steps to perform thermal simulation in Ansys Discovery. We will see how use of heat sinks guarantees thermal safety of CPUs in electronic devices.

      Download the Simulation files from here to follow the steps in the document.

      Refer Design Scenarios for thermal safety of CPUs article where we will explore the impact of material, geometry, and heat sink operating environment to lower the temperature of the CPUs.

      Using Parametric Analysis in Heat sink with two CPUs using Ansys Discovery we will learn how changing the flow speed influences lowering the temperature of CPUs for intense computations.

       

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