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PCB Design

PCB Design

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  3. ANSYS SIwave: Electrothermal Analyses of a PCB – Part V (Mechanical Reliability)

ANSYS SIwave: Electrothermal Analyses of a PCB – Part V (Mechanical Reliability)

Tagged: ansys, ANSYS SIwave, ansys-icepak, chip package system, dcir, ddr3, dielectric, elastic strain, FR4, heat sinks, icepak, microprocessor, Power loss, power-integrity, schematic, Signal Integrity analysis, siwave, voltage regulator module, vrm
    • July 4, 2022 at 7:00 am
      Watch & LearnWatch & Learn
      Participant

      This video demonstrates how to use the same printed circuit board and link its electro-thermal analysis results to ANSYS Mechanical using ANSYS Workbench. In this part we show how to setup the board to perform structural analysis. ANSYS SIwave is a specialized design platform for power integrity, signal integrity and EMI analysis of electronic packages and PCBs.

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