Ansys Assistant will be unavailable on the Learning Forum starting January 30. An upgraded version is coming soon. We apologize for any inconvenience and appreciate your patience. Stay tuned for updates.

Innovation Space

FREE STUDENT SOFTWARE

Thermally aware photonic circuit simulation of a WDM transceiver – Icepak integration

- October 17, 2025 at 12:09 pm
  
  Solution
  Participant
  
  In this example, Ansys Lumerical INTERCONNECT’s capability in modeling Photonic Integrated Circuit (PIC) is combined with Icepak’s powerful thermal simulation capability to simulate and design a Wavelength Division Multiplexing (WDM) transceiver while accounting for the heating from the other domains in the package (e.g., Electronic Integrated Circuit (EIC), Printed Circuit Board (PCB), etc.).
  Read the full article here: https://optics.ansys.com/hc/en-us/articles/5258777726227

Add Tags

Share to Feed

Cancel Save Draft Post