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May 12, 2021 at 4:08 pm
bsr
SubscriberThe exported design in Q3D displays an air gap in between a via and adjacent copper plane. Could you please suggest some options with which there are no such flaws in the geometry?
In the following figures I am displaying a flaw as well as all the options used for exporting the file to Q3D? The PCB was designed using Altium and imported into SIWAVE using "Import ODB++" option.
May 20, 2021 at 1:34 pmPraneeth
Ansys Employee
I think the issue is with the default rendering. Even though it looks like there are air gaps between them it is not true.
You could use "right mouse click on 3D modeler window - view - render - curved object visualization" to view them. Them change the settings to your need and verify this.
The default rendering will utilize less CPU resources.
All the very best.
May 20, 2021 at 2:15 pmbsr
SubscriberYou are right and this resolves the issue. Thanks a lot!
Viewing 2 reply threads- The topic ‘What are the correct options/settings for exporting a PCB layout from SIWAVE to Q3D?’ is closed to new replies.
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