thermal cycling

- February 6, 2021 at 8:12 am
  
  jeny
  Subscriber
  
  I want to do a thermal cycling on an IGBT module and analyze it for solder layer fatigue . I have managed to design and give material properties. However, when trying to run the simulation, I am getting an error saying, your product license has numerical problem size limits, you have exceeded these problem size limits and the solver cannot proceed.nCould someone guide me on how to overcome this?n
- February 6, 2021 at 1:22 pm
  
  peteroznewman
  Subscriber
  
  Ask your professor if your institution has an ANSYS Research license that you can use. They may have purchased some licenses. If you use that, there are no problem size limits.nIf you use the free ANSYS Student license you downloaded here, that will not solve models where the node or element number is greater than 32,000. To fix that, use symmetry to reduce your model size. Reduce the mesh density. Use shell or beam elements instead of solid elements.n
- February 6, 2021 at 4:48 pm
  
  jeny
  Subscriber
  
  Will do! Thank you for the quick response!n