We have an exciting announcement about badges coming in May 2025. Until then, we will temporarily stop issuing new badges for course completions and certifications. However, all completions will be recorded and fulfilled after May 2025.
Electronics

Electronics

Topics related to HFSS, Maxwell, SIwave, Icepak, Electronics Enterprise and more.
  1. All Channels
  2. Electronics
  3. Icepak analysis of electronic component guidance

Icepak analysis of electronic component guidance

TAGGED: , , ,

    • February 19, 2023 at 3:43 am
      ThermalSamoyed
      Subscriber

      Hello,

      I'm trying to model a TO-220 package with a theta_jc of 5 C/W with a heat sink attached to the side of the package and have a few questions

      1) is it accurate to model the electronic as a block with 2 node resistor. My plan was to set the ta_jc as 5 c/w (from spec sheet) and calculate the theta_jb as the theta_jc resistance + lead resistance. Is that acceptable or am I double booking theta_jc?

      thanks

    • February 21, 2023 at 1:28 pm
      Pdev
      Ansys Employee

      Hello, 

      1) It would be best to get the Theta_jb from the vendor. Using the Theta_jb as Theta_jc+ lead resistance will affect the accuracy of the solution.

      2) This is a design decision. As an Ansys employees I cannot provide help on the design decision. We encourage any other forum members to pitch in for this.

      Please let me know if you have any simulation related questions. 

      Thanks! 
      Pdev

Viewing 1 reply thread
  • The topic ‘Icepak analysis of electronic component guidance’ is closed to new replies.
Ansys Innovation Space

© 2025 Copyright ANSYS, Inc. All rights reserved.

Ansys does not support the usage of unauthorized Ansys software. Please visit www.ansys.com to obtain an official distribution.