We have an exciting announcement about badges coming in May 2025. Until then, we will temporarily stop issuing new badges for course completions and certifications. However, all completions will be recorded and fulfilled after May 2025.
Electronics

Electronics

Topics related to HFSS, Maxwell, SIwave, Icepak, Electronics Enterprise and more.

How assign the thermal resistance correctly in AEDT Icepak

    • vishalgnair1812
      Subscriber

      I have a QFN package cad model made in solidworks. The die is disspating heat of 100 W and the junction to case resistance is 0.5 °C/W. I tried assigning the top surface of die and bottom surface of thermal pad as network model and gave the thermal resistance. But, everytime I do that the solution divereges. What can be the solution for this problem and if anyone could share a how a network model will be it could be helpful.

      Thank you

    • Rabindra Paul
      Ansys Employee

      Hi Vishal: Thanks for using Forum to ask question. You may review workshop 1 for AEDT Icepak Introductory training material for the steps to create 2-R network. Please make sure: Network block have Solve Inside turned off
      ‐ Make sure ‘Solve Inside’ option is turned off for the Die object which you are modeling as a network. 

      However, solution divergence could have for many other reasons.

       

      Hope this is of help.

       

      Regards,

       

      Rabindra

    • vishalgnair1812
      Subscriber

      Hi Rabindra. Thank you for the suggestion, I was previously missing out on the solve inside has to be unchecked.

Viewing 2 reply threads
  • You must be logged in to reply to this topic.