Hfss 3D pcb via capped and filled with epoxy

- September 2, 2025 at 1:56 pm
  
  kagankarakusx
  Subscriber
  
  Hello, I transferred a pcb from altitum to ansys hfss3d layout as edb, I want to convert this via to a capped via and fill an insulating epoxy into the hole when necessary, how can I do this?
- September 11, 2025 at 10:20 am
  
  Atsuko Kikuchi
  Ansys Employee
  
  Such vias cannot be configured in HFSS 3D Layout. Since it is possible in HFSS, I recommend converting the design to HFSS model and simulating there.
  How to export a design from HFSS 3D Layout to HFSS 3D Classic:
  1. define an HFSS Solution Setup in the HFSS 3D Layout design
  2. right click on the HFSS setup name in the Project Manager window and select Export -> HFSS Model...