Ansys Assistant will be unavailable on the Learning Forum starting January 30. An upgraded version is coming soon. We apologize for any inconvenience and appreciate your patience. Stay tuned for updates.

Innovation Space

Free Discovery Trial

Hfss 3D pcb via capped and filled with epoxy

- September 2, 2025 at 1:56 pm
  
  kagankarakusx
  Subscriber
  
  Hello, I transferred a pcb from altitum to ansys hfss3d layout as edb, I want to convert this via to a capped via and fill an insulating epoxy into the hole when necessary, how can I do this?
- September 11, 2025 at 10:20 am
  
  Atsuko Kikuchi
  Ansys Employee
  
  Such vias cannot be configured in HFSS 3D Layout. Since it is possible in HFSS, I recommend converting the design to HFSS model and simulating there.
  How to export a design from HFSS 3D Layout to HFSS 3D Classic:
  1. define an HFSS Solution Setup in the HFSS 3D Layout design
  2. right click on the HFSS setup name in the Project Manager window and select Export -> HFSS Model...

Viewing 1 reply thread

You must be logged in to reply to this topic.

[bingo_chatbox]