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Electronics

Electronics

Topics related to HFSS, Maxwell, SIwave, Icepak, Electronics Enterprise and more.

Hfss 3D pcb via capped and filled with epoxy

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    • kagankarakusx
      Subscriber

      Hello, I transferred a pcb from altitum to ansys hfss3d layout as edb, I want to convert this via to a capped via and fill an insulating epoxy into the hole when necessary, how can I do this?

       

      Via in Pad PCB Design | MacroFab

    • Atsuko Kikuchi
      Ansys Employee

      Such vias cannot be configured in HFSS 3D Layout. Since it is possible in HFSS, I recommend converting the design to HFSS model and simulating there.

      How to export a design from HFSS 3D Layout to HFSS 3D Classic:
       1. define an HFSS Solution Setup in the HFSS 3D Layout design
       2. right click on the HFSS setup name in the Project Manager window and select Export -> HFSS Model...

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