Learning Forum

[Thomas Capuano]

Hi,

I am trying to export my Analysis from HFSS 3D Layout to HFSS. Everything appears to transfer correctly, expect the board outline, which has a hole in it. Does anyone know how to do this operation? The help documention on board outline is sparse.

Regards,

Tom

[Rong Liu]

Hi, Tom, 

You want to have Show Dielectrics checked, then turn on only one layer one by one to find out which layer has the outline with a hole in HFSS 3D layout. The Outline layer in HFSS 3D layout won't be transferred to HFSS. What you see might be a dielectric layer.  

Please feel free to open a support case. This links shows how. 
/courses/index.php/courses/ansys-customer-support-space/lessons/submit-a-support-case-in-the-ansys-customer-support-space/

 

 

Best regards,

Rong

[Thomas Capuano]

Hi,

Thank you for the information. 

So there is no way to export the dielectric shape to HFSS?

Tom

 

[Rong Liu]

Hi, Tom, 

 

No, the dielectric layer will be export to HFSS. 

If you take a look at the Stackup setting, there are non-stackup layers, one of them is called Outline. The non-stackup layers will not be exported to HFSS. Dielectric Layers are Stacup layers, the shapes on dielectric layers will be exported to HFSS.

Best regards,

Rong