Learning Forum

[Yoo JaeGon]

I'm trying to simulation the thin film bulge test.

My goals are calculate the residual stress, maximum stress, fracture stress.

Now, I want to reproduce the paper result 'microelectronics: Design, Technology, and Packaging III. SPIE, p. 337-344, 2007'

1. My problem is i don't know how to insert the residual stress in the film for initial condition

2. Since our sample is suspended membrane on substrate, maybe delamination will occur at the edge of contact region. So, I want to know what kind of contact condition is good for our simulation. 

3. Maybe I can use the fracture condition to check the delamination at the edge. but I'm not familiar with the program, I don't know what condition will be fitted for our simulation.

Thank you for your help.

[Ashish Khemka]

Hi,

Please see if the following links help:

Template LS-DYNA Confernece (ansys.com)

Cohesive Zone Model Delamination Solution Results (ansys.com)

ANSYS Mechanical: Delamination Analysis using Contact Debonding (youtube.com)

Regards,

Ashish Khemka

 

[Yoo JaeGon]

Dear Ashish Khemka

I will check about your link

Thank you for your help