Learning Forum

[kagankarakusx]

I have two questions:
First  if a file format is extracted as edb with a stackup set in altium, will the dielectric and layer thicknesses be added in the same way in the stackup in siwave?

Didn't we already specify the prepreg and core materials in the layers below?

My other question is what does "dielectricc fill" mean in the copper layer in the layer stackup editor?
or can you provide documentation?

[Aymen Mzoughi]

Rgarding the first question:
When importing Ansys EDB from Altium, the SIwave stackup will exactly match the one in Altium. (dielectrics, layer thickness etc...)

Regarding the second question:

The dielectric fill can refer to materials like FR4 epoxy used between layers of a PCB stack-up. The software automatically inserts dielectric fill layers in certain modes to account for the space between conductive layers, ensuring accurate simulation of the physical structure. A dielectric fill of one mil FR4 epoxy is automatically inserted between layers to account for spacing that is not just the substrate thickness but also includes the dielectric material. 

More information can be found in the Ansys online help:

https://ansyshelp.ansys.com/public//Views/Secured/Electronics/v242/en/Subsystems/HFSS/HFSS.htm#3DLayout/LaminateStackup.htm