Reply To: About siwave edb stackup.

[Aymen Mzoughi]

Rgarding the first question:
When importing Ansys EDB from Altium, the SIwave stackup will exactly match the one in Altium. (dielectrics, layer thickness etc...)

Regarding the second question:

The dielectric fill can refer to materials like FR4 epoxy used between layers of a PCB stack-up. The software automatically inserts dielectric fill layers in certain modes to account for the space between conductive layers, ensuring accurate simulation of the physical structure. A dielectric fill of one mil FR4 epoxy is automatically inserted between layers to account for spacing that is not just the substrate thickness but also includes the dielectric material. 

More information can be found in the Ansys online help:

https://ansyshelp.ansys.com/public//Views/Secured/Electronics/v242/en/Subsystems/HFSS/HFSS.htm#3DLayout/LaminateStackup.htm