If I am expecting a drop in wall temperature due to a rise in heat flux this shouldn't be a CHF case. But even plotting the Total surface heat flux or the Evaporation heat Flux on that heated interface shows that both of them are very low. Why could that be? Is it a body forces problem that is not capturing the evaporation happening?Â
I see you have used growth layers in the RPI boiling verification case which I was suggested not to use by one of your moderators for wall boiling. How crucial are they?Â
Secondly, you dont use wall lubrication at all. But plotting your wall temperature axially also shows that the temperature plateaus and the boiling does not really decrease the wall temperature. Was that the expected result?
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